Many people will choose to use FRP anti-corrosion board, because it has a strong anti-corrosion function. But, there is still a possibility of mold, so we can't take it lightly. The following are the causes of this problem.
- Material property
Although it is specially treated to resist corrosion and mold growth. However, the board can still be affected by humidity and excessive moisture content, in addition, the glue used can contain toxic substances such as formaldehyde, which can kill mold, but can also cause the board to be more prone to mold.
- Environmental factors
In humid weather or rainy season, the humidity in the air is higher, which provides favorable conditions for the growth of mold. Mildew is likely to occur if it is not properly dried or if the humidity in the storage and use environment exceeds its tolerance limits.
- Improper use and maintenance
If cleaning and drying are not done properly during daily maintenance, such as frequent wiping with a damp cloth or long-term exposure in a humid environment, moisture may penetrate into the board, thereby promoting the growth of mold. In addition, if there is no proper anti-mold treatment before construction, such as soaking or brushing with anti-mold agents, it will also increase the risk of mold.
- Inadequate anti-mold treatment
If not enough mildew inhibitors are added during production or construction, or if mildew prevention treatment is improper, the mildew resistance of the FRP anti-corrosion board may be insufficient. In addition, if it is not properly ventilated and dried during delivery and drying, it may also cause mold.
- Long-term exposure to high humidity
If the board is exposed to high humidity for a long time and is not dried in time, it is easy to accumulate moisture, thus promoting the growth of mold, especially in the humid air of the southern coastal areas.
The above are the main factors that cause FRP anti-corrosion panels to mold. We hope to remind everyone to properly store and maintain the panels to prevent them from getting moldy.
